Abstract <p>The influence of homogenization annealing on the structure and properties of aluminum heat-resistant ALTEK alloys is studied. The 2Cu_1.5Mn and 3Cu₂Mn alloys are homogenized at 450°C (30 h) followed by hot and cold rolling to a thickness of 1 mm and heat treatment at 300–500°C (3 h). It is found that homogenization annealing allows achieving higher specific electrical conductivity (SEC) compared to non-homogenized alloys owing to the earlier onset of decomposition of the aluminum solid solution. However, a decrease in strength characteristics is observed: after annealing at 300°C, the tensile strength decreases to 25%, while non-homogenized alloys demonstrate higher thermal stability—their strength decreases by 3% compared to the cold-rolled state. This phenomenon is most likely due to the fact that homogenization promotes the growth of Al₂₀Cu₂Mn₃ particles, which makes the latter less effective in inhibiting the processes of recovery and recrystallization. For the 2Cu_1.5Mn and 3Cu₂Mn alloys, after annealing at 400°C (3 h), the following properties are obtained: tensile strength is 215 and 201 MPa, conditional yield strength is 79 and 81&#xa0;MPa, relative elongation is 16.4 and 19.2%, and SEC is 27.7 and 28.6 MS/m.</p>