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Abstract <p>Paper presents a physical description of the formation of a positive charge layer around the object of study during processing in a high-frequency capacitively coupled plasma (CCP) discharge, resulting in a directed low-energy ionic flux bombarding the surface of the modified product. Holographic measurements have demonstrated the presence of a layer different from the plasma in the discharge area around the processed body. The hologram rewriting method was recognized as the optimal measurement method, the essence of which was the sequential registration of holograms using reconstructed waves from the previous hologram, thereby increasing the measurement sensitivity coefficient. The theoretical justification of holographic measurements is presented, and the effect of plasma potential. The experimental methodology and measuring equipment are described in detail.</p>

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Features of the Formation of a Positive Charge Layer during Modification of Products in a CCP Discharge under Dynamic Vacuum Conditions

  • 期刊论文

  • 发表日期：

    2025年6月1日

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  • I. Sh. Abdullin,
  • V. S. Zheltukhin,
  • I. K. Nekrasov,
  • M. F. Shaekhov,
  • F. R. Sagitova

摘要

Abstract

Paper presents a physical description of the formation of a positive charge layer around the object of study during processing in a high-frequency capacitively coupled plasma (CCP) discharge, resulting in a directed low-energy ionic flux bombarding the surface of the modified product. Holographic measurements have demonstrated the presence of a layer different from the plasma in the discharge area around the processed body. The hologram rewriting method was recognized as the optimal measurement method, the essence of which was the sequential registration of holograms using reconstructed waves from the previous hologram, thereby increasing the measurement sensitivity coefficient. The theoretical justification of holographic measurements is presented, and the effect of plasma potential. The experimental methodology and measuring equipment are described in detail.