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Abstract <p>The paper presents the kinetic data on the curing of an epoxy oligomer with an amine curing agent in terms of dielectric constant in comparison with shrinkage processes and residual stresses build-up. It was shown that the kinetic data on the curing of the ED-20 + TETA system obtained by different methods (dielectric constant, shrinkage, and residual stresses) allow one to evaluate the course of chemical reaction only in the kinetic region and practically do not cover the diffusion region. It was found that the kinetic data obtained for the curing of the ED-20 + TETA system in terms of dielectric constant and volume shrinkage correlate well with each other. The time lag of residual stresses build-up compared to dielectric constant and volume shrinkage indicates the coupling of these processes and their relaxation nature. To reduce the level of residual stresses in the diffusion region (from 11 to 22 h) in the technological curing process of the ED-20 + TETA system it is necessary to use heat treatment with temperature rise up to 80–100°C, increasing the rate of relaxation processes with almost constant volume shrinkage.</p>

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Study of Dielectric Constant, Shrinkage, and Residual Stresses during Curing of Epoxy Oligomers

  • 期刊论文

  • 发表日期：

    2025年9月17日

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  • G. I. Ezdakov,
  • D. A. Trofimov,
  • A. M. Khort,
  • I. D. Simonov-Emel’yanov

摘要

Abstract

The paper presents the kinetic data on the curing of an epoxy oligomer with an amine curing agent in terms of dielectric constant in comparison with shrinkage processes and residual stresses build-up. It was shown that the kinetic data on the curing of the ED-20 + TETA system obtained by different methods (dielectric constant, shrinkage, and residual stresses) allow one to evaluate the course of chemical reaction only in the kinetic region and practically do not cover the diffusion region. It was found that the kinetic data obtained for the curing of the ED-20 + TETA system in terms of dielectric constant and volume shrinkage correlate well with each other. The time lag of residual stresses build-up compared to dielectric constant and volume shrinkage indicates the coupling of these processes and their relaxation nature. To reduce the level of residual stresses in the diffusion region (from 11 to 22 h) in the technological curing process of the ED-20 + TETA system it is necessary to use heat treatment with temperature rise up to 80–100°C, increasing the rate of relaxation processes with almost constant volume shrinkage.