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Adhesion of Mold Spores to Polymer Materials During Their Deposition in Air

  • I. G. Kalinina,
  • V. B. Ivanov,
  • S. A. Semenov,
  • V. V. Kazarin,
  • O. A. Zhdanova

摘要

Abstract

The features of the adhesive interaction of spores of various types of mold fungi deposited in a stationary air environment with polymeric materials are investigated. It is shown that regardless of the type of material, its angle of inclination, and the type of fungus, all spores that have reached the polymer surface remain on it. The location of the sample relative to the source of spore propagation and the mechanism of their supply to the surface determine the number of spores retained on the material, characterizing the microbiological component of the air environment (the content and specific consumption of fungal spores in it). An algorithm for estimating this characteristic is proposed. It is advisable to take the research results into account when developing methods for testing the resistance of polymer materials to infection and damage by biodestructor fungi.