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Abstract <p>This study introduced <i>N</i>,<i>N</i> '-4,4'-diphenylmethane bismaleimide (BMI) into the epoxy-anhydride resin EP-A (bisphenol A epoxy resin type, methyl nadic anhydride (MNA)) to prepare BMI modified epoxy resin (EP-B). The curing kinetics of EP-A and EP-B were comparatively studied by differential scanning calorimetry (DSC). Results showed that compared with EP-A, the introduction of BMI effectively promoted the curing reaction process of EP-B, and all curing characteristic temperatures decreased. Moreover, multiple curing process takes place, the curing kinetics were carefully investigated by means of <i>Kissinger</i> method and <i>Ozawa</i> method; Results of thermogravimetric analysis (TGA) showed that the weight loss rate in the second stage of EP-B was significantly reduced, demonstrating the good thermal stability compared with EP-A; Further study on dielectric properties revealed that EP-B has obviously higher dielectric constant, volume resistivity and breakdown voltage, and lower dielectric loss compared to EP-A. DMA results showed that the storage modulus and glass transition temperature of EP-B was obviously higher than that of EP-A. The impact of BMI on the structure and properties were discussed in detail, and related mechanism was proposed, in order to provide theoretical basis for the preparation of high-performance EP.</p>

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Study on the Curing Kinetics and Properties of Bismaleimide Modified Anhydride Epoxy Resin

  • 期刊论文

  • 发表日期：

    2025年10月1日

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  • Yue Zhang,
  • Zhou Huang,
  • Zhihui Xie,
  • Jin An,
  • Zhiyu Chen,
  • Xu He,
  • Mingpeng He,
  • Yan Liu,
  • Jiang Zhou,
  • Bofan Shen,
  • Tong Wu,
  • Jinyao Chen,
  • Jian Kang

摘要

Abstract

This study introduced N,N '-4,4'-diphenylmethane bismaleimide (BMI) into the epoxy-anhydride resin EP-A (bisphenol A epoxy resin type, methyl nadic anhydride (MNA)) to prepare BMI modified epoxy resin (EP-B). The curing kinetics of EP-A and EP-B were comparatively studied by differential scanning calorimetry (DSC). Results showed that compared with EP-A, the introduction of BMI effectively promoted the curing reaction process of EP-B, and all curing characteristic temperatures decreased. Moreover, multiple curing process takes place, the curing kinetics were carefully investigated by means of Kissinger method and Ozawa method; Results of thermogravimetric analysis (TGA) showed that the weight loss rate in the second stage of EP-B was significantly reduced, demonstrating the good thermal stability compared with EP-A; Further study on dielectric properties revealed that EP-B has obviously higher dielectric constant, volume resistivity and breakdown voltage, and lower dielectric loss compared to EP-A. DMA results showed that the storage modulus and glass transition temperature of EP-B was obviously higher than that of EP-A. The impact of BMI on the structure and properties were discussed in detail, and related mechanism was proposed, in order to provide theoretical basis for the preparation of high-performance EP.