Technological Process of Assembly and QA Testing of Silicone Tracking Modules with Silicon Strip Sensor
摘要
Abstract
The key technological stages of assembly of silicone tracking modules with silicon strip sensors for use in the wide-aperture silicon tracking system of the BM@N experiment are considered. Methods for finding the optimal parameters for the ultrasonic linear automatic welding of aluminum microcables with a silicon sensor are described. The methodology and results of intermediate QA testing during the assembly of the silicone tracking module are presented. The method of mounting unpackaged microcircuits on a board is described. The results of the preproduction assembly of silicone tracking modules are presented.