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<b>Abstract</b>— <p>This article presents the results of a study on protective, dielectric, and thermally resistant organosilicate coatings (OSCs) based on a ladder polymer, polyphenylsilsesquioxane (PPSQ), which is used as a film-forming agent. For the first time, a classical approach is employed to calculate the formulations of pigmented coatings in relation to organosilicate compositions (OSComps). The average viscosity molecular weight of the selected film-forming agent PPSQ is determined. The developed coatings exhibit high thermal resistance up to 420°C while maintaining the necessary physicomechanical and electrophysical properties.</p>

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Optimization of the Composition of a Thermally Resistant Dielectric Organosilicate Coating Based on Ladder Polymer Polyphenylsilsesquioxane

  • 期刊论文

  • 发表日期：

    2025年4月1日

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  • V. I. Voshchikov,
  • Ya. A. Khamidulin,
  • L. N. Krasilnikova,
  • T. V. Khamova,
  • S. N. Stepin,
  • G. S. Sokolov,
  • A. G. Ivanova,
  • O. A. Shilova

摘要

Abstract—

This article presents the results of a study on protective, dielectric, and thermally resistant organosilicate coatings (OSCs) based on a ladder polymer, polyphenylsilsesquioxane (PPSQ), which is used as a film-forming agent. For the first time, a classical approach is employed to calculate the formulations of pigmented coatings in relation to organosilicate compositions (OSComps). The average viscosity molecular weight of the selected film-forming agent PPSQ is determined. The developed coatings exhibit high thermal resistance up to 420°C while maintaining the necessary physicomechanical and electrophysical properties.