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Abstract <p>Switches fabricated using microelectromechanical systems (MEMS) technology are considered as a new element base for microwave devices. Small size, high isolation, low insertion loss and power consumption make them attractive for wireless communication and radar systems. However, the implementation of MEMS switches in microwave technology is hampered by their poor reliability. Switches often fail due to contact resistance growth. The contacts degrade due to material transfer under high switching current. In this paper, the simulation results for resistive heating of microcontacts using the finite element method are presented.</p>

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Finite Element Simulation of the MEMS Switch Contact Temperature

  • 期刊论文

  • 发表日期：

    2025年12月1日

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  • I. A. Belozerov,
  • I. V. Uvarov

摘要

Abstract

Switches fabricated using microelectromechanical systems (MEMS) technology are considered as a new element base for microwave devices. Small size, high isolation, low insertion loss and power consumption make them attractive for wireless communication and radar systems. However, the implementation of MEMS switches in microwave technology is hampered by their poor reliability. Switches often fail due to contact resistance growth. The contacts degrade due to material transfer under high switching current. In this paper, the simulation results for resistive heating of microcontacts using the finite element method are presented.