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Abstract <p>This article examines the results obtained during coarse, fine, and finish grinding of polycrystalline and monocrystalline silicon carbide wafers using new types of bonded diamond tools with an organic binder and a new composition of cutting fluid (CF).</p>

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Machining of Silicon Carbide Plates with a Bonded Diamond Tool

  • 期刊论文

  • 发表日期：

    2025年10月1日

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  • V. S. Kondratenko,
  • A. A. Isaev,
  • V. V. Kadomkin,
  • G. M. Biryukov,
  • I. I. Borodynkin,
  • A. D. Tambovskii

摘要

Abstract

This article examines the results obtained during coarse, fine, and finish grinding of polycrystalline and monocrystalline silicon carbide wafers using new types of bonded diamond tools with an organic binder and a new composition of cutting fluid (CF).