Direct Laser Metallization from Deep Eutectic Solvents on Polymer Substrates
摘要
The task of local metallization of polymer substrates such as PDMS (polydimethylsiloxane) is a challenging and important task for the development of biocompatible flexible electronics. Here we present for the first time the possibility of using the Direct laser metallization (DLM) method for fabrication of copper conducting structures on PDMS. It has been shown that DLM method allows one to obtain conductive structures with low resistivity and a developed surface with minimal thermal impact on the substrate. By optimizing the scanning speed and laser power density, it was possible to minimize the thermal degradation of PDMS and ensure reliable metal adhesion. The DLM method opens up new opportunities for creating flexible electronics, providing precise and cost-effective deposition of copper conductors on flexible substrates.