3D Microstructures for Introducing Radiation into Photonic Integrated Circuits

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2024年12月1日

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D. A. Kolymagin,
A. I. Prokhodtsov,
D. A. Chubich,
R. P. Matital,
A. V. Kazantseva,
D. P. Emelyanov,
V. V. Kovalyuk,
A. G. Vitukhnovsky,
G. N. Goltsman

摘要

Abstract

Photonic integrated circuits with improved optical input are used to obtain high-performance data transmission and processing systems. Transmitance spectra are studied for 3D microstructures fabricated via two-photon polymerization for inputting radiation in the range of 1480 to 1640 nm into photonic integrated circuits. Results were compared to transmittance of diffraction gratings.