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Abstract <p>Using molecular dynamics and the embedded atom method, the regularities and mechanisms of contact melting in a noneutectic Cu–Ni bilayer were studied. For the first time, a fractal approach has been used to study the process of contact melting of a Cu–Ni bilayer. A concept of dynamic evaluation of the fractal dimension of instantaneous atomic configurations with subsequent comparison of the fractal dimension value with certain stages of the bimetallic layer evolution has been proposed. The fractal approach made it possible to identify the position of the interface in the Cu–Ni bilayer, in which the melting temperatures of its components differ significantly. Analysis of the “time” dependences of the fractal dimension allowed us to describe structural changes from the beginning of contact between two metals, followed by active mutual diffusion of components to the final melting of the bilayer. Both components are present on the surface of the final bilayer configuration.</p>

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Contact Melting Effect in a Molecular Dynamics Model of a Noneutectic Cu–Ni Bilayer

  • 期刊论文

  • 发表日期：

    2025年12月1日

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  • V. M. Samsonov,
  • N. B. Kuzmin,
  • I. V. Talyzin,
  • N. Yu. Sdobnyakov,
  • P. V. Komarov

摘要

Abstract

Using molecular dynamics and the embedded atom method, the regularities and mechanisms of contact melting in a noneutectic Cu–Ni bilayer were studied. For the first time, a fractal approach has been used to study the process of contact melting of a Cu–Ni bilayer. A concept of dynamic evaluation of the fractal dimension of instantaneous atomic configurations with subsequent comparison of the fractal dimension value with certain stages of the bimetallic layer evolution has been proposed. The fractal approach made it possible to identify the position of the interface in the Cu–Ni bilayer, in which the melting temperatures of its components differ significantly. Analysis of the “time” dependences of the fractal dimension allowed us to describe structural changes from the beginning of contact between two metals, followed by active mutual diffusion of components to the final melting of the bilayer. Both components are present on the surface of the final bilayer configuration.