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Abstract <p>Using a modern complete molecular dynamics model of single crystal sputtering taking into account ion incidence on the surface, the mechanisms of formation of the polar and azimuthal angle distribution of atoms sputtered from the surface of the (001) Ni face by Ar ions with an energy of 200 eV are studied. It is shown that the sputtered atoms overfocused by the azimuthal angle eject only near the directions corresponding to the directions to the centers of lenses of two atoms in the surface plane neighboring to the ejecting atom. It is found that in the polar angular distribution of sputtered atoms with an energy of 2.5 ± 0.1 eV in the range of the azimuthal angle of 87° ± 1.5°, close to the center of the lens, three maxima formed by atoms with significantly different mechanisms of emission are observed. It is concluded that the formation of these maxima occurs only due to the surface mechanism of single crystal sputtering.</p>

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On the Features of the Formation of Polar Distribution of Sputtered Atoms in the MD Model of the (001) Ni Face Sputtering

  • 期刊论文

  • 发表日期：

    2025年4月1日

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  • A. I. Musin,
  • V. N. Samoilov

摘要

Abstract

Using a modern complete molecular dynamics model of single crystal sputtering taking into account ion incidence on the surface, the mechanisms of formation of the polar and azimuthal angle distribution of atoms sputtered from the surface of the (001) Ni face by Ar ions with an energy of 200 eV are studied. It is shown that the sputtered atoms overfocused by the azimuthal angle eject only near the directions corresponding to the directions to the centers of lenses of two atoms in the surface plane neighboring to the ejecting atom. It is found that in the polar angular distribution of sputtered atoms with an energy of 2.5 ± 0.1 eV in the range of the azimuthal angle of 87° ± 1.5°, close to the center of the lens, three maxima formed by atoms with significantly different mechanisms of emission are observed. It is concluded that the formation of these maxima occurs only due to the surface mechanism of single crystal sputtering.