Application of Ultrasonic Vibrations to Copper Plating
摘要
Abstract
The influence of ultrasonic vibrations applied to an electrolyte during copper plating on micro- and submicrogeometric properties of a coating and characteristics of the electrodeposition process are studied. The altitude parameters of the coating roughness are found to decrease by 7.5–8.5 times, and the submicrostructural parameters are improved by 2 times with increasing copper deposition efficiency.