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Abstract <p>In a first for Russia, a 100 mm diameter wafer was processed to create holes for TSV structures using automated equipment designed for 150 mm diameter wafers without needing to reconfigure the installations. A shuttle wafer was developed for this purpose. The reliability of the silicon shuttle was determined through experimental studies of the mechanical strength of silicon. The thickness of the ultra-thin Si wafer that can be processed without damage in the shuttle wafer on installations with a vacuum table was calculated based on the data obtained.</p>

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Multifunctional Shuttle for Processing Small Diameter and Ultra-Thin Semiconductor Wafers

  • 期刊论文

  • 发表日期：

    2025年4月1日

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  • N. A. Djuzhev,
  • E. E. Gusev,
  • M. Y. Fomichev,
  • P. S. Ivanin,
  • I. V. Kushnarev,
  • V. A. Bespalov

摘要

Abstract

In a first for Russia, a 100 mm diameter wafer was processed to create holes for TSV structures using automated equipment designed for 150 mm diameter wafers without needing to reconfigure the installations. A shuttle wafer was developed for this purpose. The reliability of the silicon shuttle was determined through experimental studies of the mechanical strength of silicon. The thickness of the ultra-thin Si wafer that can be processed without damage in the shuttle wafer on installations with a vacuum table was calculated based on the data obtained.