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Abstract <p>We have investigated the mechanism responsible for aluminum (Al) coating growth on a&#xa0;titanium (Ti) substrate during cold gas spraying. Examination of the structure of coatings produced by the cold gas spraying method has shown that they contain a rough transition layer in which the Al and Ti atoms are intermixed. We assume that the formation of the transition layer is the result of collisions of microparticles with the rough substrate surface and is due to a convective mechanism. In&#xa0;simulating the intermixing process by the smoothed particle hydrodynamics method, we have numerically solved the problem of collision of an Al microparticle with a Ti substrate having a conical pit. The results point to the formation of a cumulative Al jet, which penetrates the Ti substrate, cools, solidifies, and stays in it in the form of an aluminum inclusion. Collisions of a large number of microparticles with the substrate lead to the formation of a transition layer with a reduced activation energy for the formation of bonds between atoms of the Al microparticles and Ti substrate. Colliding with the transition layer, Al microparticles can attach to its surface to form aluminum coating.</p>

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Mechanism of Aluminum Coating Formation on a Titanium Substrate during Cold Gas Spraying

  • 期刊论文

  • 发表日期：

    2025年8月1日

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  • S. P. Kiselev,
  • V. P. Kiselev,
  • K. A. Skorokhod,
  • V. S. Shikalov

摘要

Abstract

We have investigated the mechanism responsible for aluminum (Al) coating growth on a titanium (Ti) substrate during cold gas spraying. Examination of the structure of coatings produced by the cold gas spraying method has shown that they contain a rough transition layer in which the Al and Ti atoms are intermixed. We assume that the formation of the transition layer is the result of collisions of microparticles with the rough substrate surface and is due to a convective mechanism. In simulating the intermixing process by the smoothed particle hydrodynamics method, we have numerically solved the problem of collision of an Al microparticle with a Ti substrate having a conical pit. The results point to the formation of a cumulative Al jet, which penetrates the Ti substrate, cools, solidifies, and stays in it in the form of an aluminum inclusion. Collisions of a large number of microparticles with the substrate lead to the formation of a transition layer with a reduced activation energy for the formation of bonds between atoms of the Al microparticles and Ti substrate. Colliding with the transition layer, Al microparticles can attach to its surface to form aluminum coating.