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Development of Polymer Clay Nanocomposite for Flexible Packaging

  • A. I. Teptina,
  • Y. A. Timoshina,
  • E. F. Voznesensky

摘要

Abstract

The paper presents the results of a study on the development of polymer clay nanocomposite for flexible packaging. The studies have shown that the inclusion of nanocomposite layer in the composition of multilayer materials leads to a decrease in the rate of oxygen passage through the material. The use of nanocomposite layer in the composition of film laminates leads to an increase in their tensile strength and weld strength. The application of gas discharge pretreatment leads to an increase in the adhesion of polymer films to the polymer clay nanocomposite. The obtained results can be used to create multilayer flexible packaging materials with barrier properties, increased heat-welding ability and improved physical and mechanical characteristics.