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<p>Optimizing post-processing procedures, such as hot isostatic pressing (HIP), is crucial for minimizing defects in additively manufactured aluminum alloy 6061 (6061) components. In this study, we introduce a multiscale modeling framework integrating molecular dynamics, mesoscale reaction–diffusion, and finite-element modeling to optimize the HIP process by identifying optimal parameters. Our findings reveal that bonding criteria are primarily determined by the rate of magnesium diffusion and the thickness of the Al<sub>2</sub>O<sub>3</sub> layer, leading to the formation of a complex spinel phase at the interface. The multiscale model highlights temperature as the most significant factor influencing bond quality. With HIP temperatures exceeding 400 °C, bond interface voids collapse completely, resulting in desirable bond characteristics and strength. Below 400 °C, void closure is challenging, with multiple factors contributing to the process. This approach offers comprehensive strategies for post-processing optimization, improving bond quality and cutting experimental costs, thus advancing the performance of AA6061 in high-demand applications.</p>

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Optimizing post-processing procedures to enhance bond quality of additively manufactured aluminum alloy 6061 using multiscale modeling

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2025年6月30日

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  • Yucheng Fu,
  • C. J. Taylor Mason,
  • Rajib Kalsar,
  • Ankit Roy,
  • Miao Song,
  • Kenneth I. Johnson,
  • Zhijie Xu,
  • Kriston P. Brooks,
  • Naveen K. Karri,
  • Matthew J. Olszta,
  • Curt Lavender,
  • Ayoub Soulami,
  • Vineet V. Joshi

摘要

Optimizing post-processing procedures, such as hot isostatic pressing (HIP), is crucial for minimizing defects in additively manufactured aluminum alloy 6061 (6061) components. In this study, we introduce a multiscale modeling framework integrating molecular dynamics, mesoscale reaction–diffusion, and finite-element modeling to optimize the HIP process by identifying optimal parameters. Our findings reveal that bonding criteria are primarily determined by the rate of magnesium diffusion and the thickness of the Al2O3 layer, leading to the formation of a complex spinel phase at the interface. The multiscale model highlights temperature as the most significant factor influencing bond quality. With HIP temperatures exceeding 400 °C, bond interface voids collapse completely, resulting in desirable bond characteristics and strength. Below 400 °C, void closure is challenging, with multiple factors contributing to the process. This approach offers comprehensive strategies for post-processing optimization, improving bond quality and cutting experimental costs, thus advancing the performance of AA6061 in high-demand applications.