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<p>High-fidelity wearable bioelectronics aims to establish seamless integration between electronic devices and biological systems to enable real-time health monitoring, disease diagnosis, and multimodal interaction. Central to this integration are the bio–electronic interfaces, which require conformal alignment and optimized electrical and mechanical properties to ensure stable and accurate signal acquisition. Traditional bioelectronic devices frequently fail to achieve good conformity at the microscale and nanoscale, lacking fabrication processes feasible for customized three-dimensional (3D) microstructures and nanostructures. In this Review, we discuss advances in 3D manufacturing technologies, focusing on those techniques that, enabling the fabrication of cross-scale, multimaterial structures, address key challenges in spatial complexity and mechanical mismatch at the bio–electronic interface. These innovations promote both long-term wearability and high-fidelity signal integrity. Interdisciplinary collaboration — particularly the integration of artificial intelligence — is essential for driving successful transformation in the field. Delivering cost-effective and scalable solutions for the fabrication of high-fidelity bioelectronic devices is crucial to realize their transformative potential in healthcare, human–machine interaction, and personalized medicine.</p>

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Three-dimensional micro- and nanomanufacturing techniques for high-fidelity wearable bioelectronics

  • 期刊论文

  • 发表日期：

    2025年5月21日

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  • Peidi Fan,
  • Ying Liu,
  • Yuxiang Pan,
  • Yibin Ying,
  • Jianfeng Ping

摘要

High-fidelity wearable bioelectronics aims to establish seamless integration between electronic devices and biological systems to enable real-time health monitoring, disease diagnosis, and multimodal interaction. Central to this integration are the bio–electronic interfaces, which require conformal alignment and optimized electrical and mechanical properties to ensure stable and accurate signal acquisition. Traditional bioelectronic devices frequently fail to achieve good conformity at the microscale and nanoscale, lacking fabrication processes feasible for customized three-dimensional (3D) microstructures and nanostructures. In this Review, we discuss advances in 3D manufacturing technologies, focusing on those techniques that, enabling the fabrication of cross-scale, multimaterial structures, address key challenges in spatial complexity and mechanical mismatch at the bio–electronic interface. These innovations promote both long-term wearability and high-fidelity signal integrity. Interdisciplinary collaboration — particularly the integration of artificial intelligence — is essential for driving successful transformation in the field. Delivering cost-effective and scalable solutions for the fabrication of high-fidelity bioelectronic devices is crucial to realize their transformative potential in healthcare, human–machine interaction, and personalized medicine.