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<p>Millimeter-wave switches are essential for reconfigurable and adaptive communication systems, yet current solutions often face trade-offs between performance, scalability, and cost. Here we present a scalable, high performance and cost-effective approach to develop reconfigurable millimeter-wave substrate integrated waveguide (SIW) devices by integrating vanadium dioxide (VO₂) thin films with printed circuit board (PCB) technologies. The integration technique involves depositing VO₂ films on thin, flexible polymer substrates, which are then transferred and affixed to PCB circuits. The VO₂ is thermally activated and selectively doped to reduce power consumption depending on applications. Using experimental prototypes, we demonstrate several reconfigurable devices operating in the millimeter-wave band, including series and parallel switches and a reconfigurable hybrid coupler that transforms into dual through-line SIWs. Electromagnetic simulations and measurements validate the approach, revealing low insertion loss, good isolation, and broadband operation. This method simplifies fabrication and supports large-area integration, offering a practical route to scalable, low-cost, reconfigurable millimeter-wave components.</p>

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Vanadium dioxide thin films integrated with printed circuit board enables low-cost, reconfigurable millimeter-wave devices

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2025年10月7日

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  • Amir Afshani,
  • Wenqiang Xiang,
  • Tarek Djerafi,
  • Mohamed Chaker

摘要

Millimeter-wave switches are essential for reconfigurable and adaptive communication systems, yet current solutions often face trade-offs between performance, scalability, and cost. Here we present a scalable, high performance and cost-effective approach to develop reconfigurable millimeter-wave substrate integrated waveguide (SIW) devices by integrating vanadium dioxide (VO₂) thin films with printed circuit board (PCB) technologies. The integration technique involves depositing VO₂ films on thin, flexible polymer substrates, which are then transferred and affixed to PCB circuits. The VO₂ is thermally activated and selectively doped to reduce power consumption depending on applications. Using experimental prototypes, we demonstrate several reconfigurable devices operating in the millimeter-wave band, including series and parallel switches and a reconfigurable hybrid coupler that transforms into dual through-line SIWs. Electromagnetic simulations and measurements validate the approach, revealing low insertion loss, good isolation, and broadband operation. This method simplifies fabrication and supports large-area integration, offering a practical route to scalable, low-cost, reconfigurable millimeter-wave components.