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<p>Enhancing the fracture toughness of diamond while preserving its hardness is a substantial challenge. Most toughening strategies have primarily focused on modulating the internal microstructural units of diamonds, such as adjusting the stacking sequences, faults, nanotwinning and the incorporation of amorphous phases, collectively referred to as intrinsic toughening. Here we introduce an extrinsic toughening strategy to develop a tough diamond composite with complex and abundant <i>sp</i><sup>2</sup>–<i>sp</i><sup>3</sup>-hybridized bonding interfaces by incorporating highly dispersed multi-walled carbon nanotubes (MWCNTs) into the gaps between diamond grains to create a toughened heterogeneous structure containing a three-dimensional continuous MWCNT network. The resultant composite has a hardness of ~91.6 GPa and an average fracture toughness measured using a single-edge notched beam of 31.9 MPa m<sup>1/2</sup> (with a maximum of 36.4 MPa m<sup>1/2</sup>), which is approximately five times higher than that of single-crystal diamond and even surpasses that of tungsten alloys. The toughening can be attributed to the formation of mixed <i>sp</i><sup>2</sup>–<i>sp</i><sup>3</sup>-hybridized bonding interactions at the three-dimensional continuous MWCNT network/diamond interfaces, which facilitate efficient energy dissipation. Simultaneously, a three-dimensional diamond framework with robust D–D bonding was built, which prevented the loss of hardness due to MWCNT incorporation.</p><p></p>

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Multi-walled carbon nanotube network-toughened diamond composite via atomic interface continuity

  • 期刊论文

  • 发表日期：

    2026年7月9日

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  • Jiawei Zhang,
  • Keliang Qiu,
  • Tengfei Xu,
  • Xi Shen,
  • Junkai Li,
  • Fengjiao Li,
  • Richeng Yu,
  • Huiyang Gou,
  • Duanwei He,
  • Liping Wang,
  • Zhongzhou Wang,
  • Guodong Li,
  • Yusheng Zhao,
  • Ke Chen,
  • Fang Hong,
  • Ruifeng Zhang,
  • Xiaohui Yu

摘要

Enhancing the fracture toughness of diamond while preserving its hardness is a substantial challenge. Most toughening strategies have primarily focused on modulating the internal microstructural units of diamonds, such as adjusting the stacking sequences, faults, nanotwinning and the incorporation of amorphous phases, collectively referred to as intrinsic toughening. Here we introduce an extrinsic toughening strategy to develop a tough diamond composite with complex and abundant sp2–sp3-hybridized bonding interfaces by incorporating highly dispersed multi-walled carbon nanotubes (MWCNTs) into the gaps between diamond grains to create a toughened heterogeneous structure containing a three-dimensional continuous MWCNT network. The resultant composite has a hardness of ~91.6 GPa and an average fracture toughness measured using a single-edge notched beam of 31.9 MPa m1/2 (with a maximum of 36.4 MPa m1/2), which is approximately five times higher than that of single-crystal diamond and even surpasses that of tungsten alloys. The toughening can be attributed to the formation of mixed sp2–sp3-hybridized bonding interactions at the three-dimensional continuous MWCNT network/diamond interfaces, which facilitate efficient energy dissipation. Simultaneously, a three-dimensional diamond framework with robust D–D bonding was built, which prevented the loss of hardness due to MWCNT incorporation.