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<p>The design of advanced functionality in superconducting electronics usually focuses on materials engineering, either in heterostructures or in compounds of unconventional quantum materials. Here we demonstrate a different strategy to bespoke function by controlling the 3D shape of superconductors on the micron-scale. As a demonstration, a large superconducting diode effect is engineered solely by 3D shape design of a conventional superconductor, ion-beam deposited tungsten. Its highly efficient diode behavior appears from its triangular cross-section when vortices break time-reversal and all mirror symmetries. Interestingly reciprocity is observed at four low-symmetry field angles where diode behavior would be expected. This can be understood as a geometric mechanism unique to triangular superconductors. Geometry and topology induce a rich internal structure due to the high-dimensional tuning parameter space of 3D microstructures, inaccessible to the conventional 2D design strategies in thin films.</p>

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Geometrical design of 3D superconducting diodes

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2025年4月13日

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  • Philip JW Moll

摘要

The design of advanced functionality in superconducting electronics usually focuses on materials engineering, either in heterostructures or in compounds of unconventional quantum materials. Here we demonstrate a different strategy to bespoke function by controlling the 3D shape of superconductors on the micron-scale. As a demonstration, a large superconducting diode effect is engineered solely by 3D shape design of a conventional superconductor, ion-beam deposited tungsten. Its highly efficient diode behavior appears from its triangular cross-section when vortices break time-reversal and all mirror symmetries. Interestingly reciprocity is observed at four low-symmetry field angles where diode behavior would be expected. This can be understood as a geometric mechanism unique to triangular superconductors. Geometry and topology induce a rich internal structure due to the high-dimensional tuning parameter space of 3D microstructures, inaccessible to the conventional 2D design strategies in thin films.