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<p>Rising heat flux in compact electronics demands advanced microchannel cooling with enhanced heat transfer and minimal pressure drop penalties. This study provides a comprehensive assessment of the coupled effects of microchannel geometry, porous-medium characteristics, and operating conditions on the thermo-hydraulic performance of a porous-foam-enhanced wavy microchannel heat sink. A three-dimensional computational fluid dynamics (CFD) model was developed and the governing mass, momentum, and energy equations were solved using the finite volume method. The porous copper foam was modeled as a homogeneous porous medium under the local thermal equilibrium (LTE) assumption. The thermo-hydraulic characteristics of a microchannel with wavy surfaces featuring cubic obstacles and copper foam have been studied through three different parameters: geometry (ratio of the height of the porous layer on the walls and the ratio of the height of the porous layer on the rib, varying from 0.1 to 0.9), microstructure of the material (copper foams with various porosity, permeability, and pore density), and operating conditions (Reynolds number from 100 to 900 and inlet temperature from 293 to 301&#xa0;K). Results demostrate that the combination of an increase in both the height of the obstacle and the thickness of the porous material of the wall improves heat transfer. The comparison between 0.1/0.1 and 0.5/0.9 configurations indicate that the Nusselt number rises by 96%, while the highest temperature decreases by 1.6%. On the other hand, the friction factor is increased. In terms of operating conditions, increasing the Reynolds number from 100 to 900 boosts Nusselt by 108% and reduces friction by 58%; Re = 800 acts as a knee point, achieving 95% of the maximum PEC with 18–21% lower pressure drop than Re = 900. For Re = 600, an increase in the inlet temperature from 293 to 301&#xa0;K leads to a relatively moderate improvement in terms of thermal efficiency. Indeed, in such conditions, the Nusselt number is increased by 1.3%, and the friction factor is decreased by 7.2%, leading to the PEC being improved by 3.86%. Therefore, the inlet temperature equal to 301&#xa0;K provides a more effective thermo-hydraulic performance in the considered case. In general, the obtained data prove the fact that using porous copper foam in wavy microchannel with flow obstacles leads to the improvement of heat transfer in electronic devices. As this process is accompanied by increasing fluid mixing and heat transfer surface, the achieved result is positive considering the acceptable hydraulic losses.</p>

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Performance enhancement of a wavy microchannel heat sink by geometric modification and porous copper foam integration

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2026年7月4日

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  • Bahram Jafari,
  • Khashayar Hosseinzadeh,
  • Ali Mehrzad,
  • A. M. Mohammadzadeh

摘要

Rising heat flux in compact electronics demands advanced microchannel cooling with enhanced heat transfer and minimal pressure drop penalties. This study provides a comprehensive assessment of the coupled effects of microchannel geometry, porous-medium characteristics, and operating conditions on the thermo-hydraulic performance of a porous-foam-enhanced wavy microchannel heat sink. A three-dimensional computational fluid dynamics (CFD) model was developed and the governing mass, momentum, and energy equations were solved using the finite volume method. The porous copper foam was modeled as a homogeneous porous medium under the local thermal equilibrium (LTE) assumption. The thermo-hydraulic characteristics of a microchannel with wavy surfaces featuring cubic obstacles and copper foam have been studied through three different parameters: geometry (ratio of the height of the porous layer on the walls and the ratio of the height of the porous layer on the rib, varying from 0.1 to 0.9), microstructure of the material (copper foams with various porosity, permeability, and pore density), and operating conditions (Reynolds number from 100 to 900 and inlet temperature from 293 to 301 K). Results demostrate that the combination of an increase in both the height of the obstacle and the thickness of the porous material of the wall improves heat transfer. The comparison between 0.1/0.1 and 0.5/0.9 configurations indicate that the Nusselt number rises by 96%, while the highest temperature decreases by 1.6%. On the other hand, the friction factor is increased. In terms of operating conditions, increasing the Reynolds number from 100 to 900 boosts Nusselt by 108% and reduces friction by 58%; Re = 800 acts as a knee point, achieving 95% of the maximum PEC with 18–21% lower pressure drop than Re = 900. For Re = 600, an increase in the inlet temperature from 293 to 301 K leads to a relatively moderate improvement in terms of thermal efficiency. Indeed, in such conditions, the Nusselt number is increased by 1.3%, and the friction factor is decreased by 7.2%, leading to the PEC being improved by 3.86%. Therefore, the inlet temperature equal to 301 K provides a more effective thermo-hydraulic performance in the considered case. In general, the obtained data prove the fact that using porous copper foam in wavy microchannel with flow obstacles leads to the improvement of heat transfer in electronic devices. As this process is accompanied by increasing fluid mixing and heat transfer surface, the achieved result is positive considering the acceptable hydraulic losses.