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<p>Optimizing channel structures is crucial for enhancing radiator performance. This study focuses on optimizing the design of a radiator with a serpentine channel configuration to enhance heat dissipation and reduce thermal stress in electronic components. Through numerical simulations and multi-objective optimization, the effects of channel diameter, distance from the channel to the radiator top, and spacing between upstream and downstream channels are analyzed. The results show that increasing the channel diameter from 2&#xa0;mm to 6&#xa0;mm reduces thermal stress by 77% and improves temperature uniformity. The optimal design parameters are determined using the hill-climbing algorithm, with a maximum deviation of only 1.83% between simulation and optimization results. By explicitly integrating thermal performance with structural stress analysis, this work presents a thermal stress–aware mechanical design methodology for serpentine-channel radiators. The proposed approach provides a balanced design framework that enhances heat dissipation while simultaneously improving the mechanical reliability of electronic components, offering practical guidance for the structural–thermal optimization of liquid-cooled electronic systems.</p>

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Structural–thermal performance optimization of a serpentine-channel radiator for electronic cooling applications

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2026年5月7日

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  • Shuangji Yang,
  • Shaowu Luo,
  • XuanLin Ye

摘要

Optimizing channel structures is crucial for enhancing radiator performance. This study focuses on optimizing the design of a radiator with a serpentine channel configuration to enhance heat dissipation and reduce thermal stress in electronic components. Through numerical simulations and multi-objective optimization, the effects of channel diameter, distance from the channel to the radiator top, and spacing between upstream and downstream channels are analyzed. The results show that increasing the channel diameter from 2 mm to 6 mm reduces thermal stress by 77% and improves temperature uniformity. The optimal design parameters are determined using the hill-climbing algorithm, with a maximum deviation of only 1.83% between simulation and optimization results. By explicitly integrating thermal performance with structural stress analysis, this work presents a thermal stress–aware mechanical design methodology for serpentine-channel radiators. The proposed approach provides a balanced design framework that enhances heat dissipation while simultaneously improving the mechanical reliability of electronic components, offering practical guidance for the structural–thermal optimization of liquid-cooled electronic systems.