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<p>WO<sub>3</sub> nanoparticles with different loading amounts (0.25 to 1.00 wt%) were mechanically mixed with Sn–Bi alloys (10 and 20 wt% Bi) for 45&#xa0;min. The Sn–Bi nanocomposite powders were mixed with a flux mixture to form solder pastes. Solder pastes with different WO<sub>3</sub> nanoparticles were deposited on the pure Cu sheets using a solder paste dispenser and heated at 275&#xa0;°C for 180&#xa0;s. The effect of the WO<sub>3</sub> nanoparticle addition on microstructure, interface, and bonding strength of Sn–10 wt% Bi solder/Cu and Sn–20 wt% Bi solder/Cu solder joints was studied. The addition of lower amounts of WO<sub>3</sub> nanoparticles (0.25 wt%) to both solder alloys improved their microstructure and wettability. The addition of small amounts of 0.25 and 0.50 wt% WO<sub>3</sub> nanoparticles to the solders changed the coarse elongated Bi structure in the solder matrix to a fine spheroidal shape and a thin discontinuous interfacial layer free of cracks and/or microvoids were formed. Addition of 0.25 wt% WO<sub>3</sub> nanoparticles to Sn–20 wt% Bi solder increased the shear strength to 42.25&#xa0;MPa and elongation to 7.1%, depicting the increases of 31.66% and 208.70%, respectively, compared to the values of ordinary one.</p>

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Development of hypoeutectic SnBi alloy solder reinforced with WO3 nanoparticles for connecting Cu substrates via thermal bonding

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2025年2月26日

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  • Naglaa Fathy,
  • Khalid M. Hafez,
  • Fahad Abdulaziz,
  • R. E. Abdelraouf,
  • Mohamed Ramadan

摘要

WO3 nanoparticles with different loading amounts (0.25 to 1.00 wt%) were mechanically mixed with Sn–Bi alloys (10 and 20 wt% Bi) for 45 min. The Sn–Bi nanocomposite powders were mixed with a flux mixture to form solder pastes. Solder pastes with different WO3 nanoparticles were deposited on the pure Cu sheets using a solder paste dispenser and heated at 275 °C for 180 s. The effect of the WO3 nanoparticle addition on microstructure, interface, and bonding strength of Sn–10 wt% Bi solder/Cu and Sn–20 wt% Bi solder/Cu solder joints was studied. The addition of lower amounts of WO3 nanoparticles (0.25 wt%) to both solder alloys improved their microstructure and wettability. The addition of small amounts of 0.25 and 0.50 wt% WO3 nanoparticles to the solders changed the coarse elongated Bi structure in the solder matrix to a fine spheroidal shape and a thin discontinuous interfacial layer free of cracks and/or microvoids were formed. Addition of 0.25 wt% WO3 nanoparticles to Sn–20 wt% Bi solder increased the shear strength to 42.25 MPa and elongation to 7.1%, depicting the increases of 31.66% and 208.70%, respectively, compared to the values of ordinary one.