The development of modern particle accelerators such as FCC-ee requires improved energy efficiency. On the SRF cavity side, the intermetallic compound \(\textrm{Nb}{}_{3}\textrm{Sn}\) is a promising alternative to niobium: its higher critical temperature (18.3 K) results into a BCS surface resistance at 4.5 K comparable to the one of Nb at 2 K, potentially allowing improved performance and reduced cryogenic costs while maintaining operation at 4.5 K. However, its brittleness makes bulk machining impractical, restricting its application to thin-film coatings. This study presents \(\textrm{Nb}{}_{3}\textrm{Sn}\) thin films deposited on copper substrates via DCMS using a single stoichiometric target. The optimization of the deposition parameters via the evaluation of the critical temperature, morphology, elemental composition and crystalline structure of the films is outlined. A niobium buffer layer is implemented to prevent copper-tin interdiffusion, and plays a key role in the film quality. The results demonstrate \(\textrm{Nb}{}_{3}\textrm{Sn}\) films deposited at \(\le\) \(650~^{\circ }\textrm{C}\) on copper substrates pre-coated with a 30 µm niobium buffer layer which exhibit a critical temperature \(\ge\) 17 K. The RF test of a film deposited via the same recipe on a bulk Nb QPR sample yielded an RF surface resistance of 23 n \(\Omega\) at 4.5 K, 20 mT and 400 MHz. These findings open the way to a scalable approach to high-performance \(\textrm{Nb}{}_{3}\textrm{Sn}\) /Cu cavities.
