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<p>Cu–Cu direct bonding using electroplated ultrafine-grain Cu (107.24&#xa0;nm) was studied in air at 110–150&#xa0;°C. Unstable grain boundaries enabled ultrafast grain growth across the bonding interface, analyzed via coincidence site lattice (CSL) boundaries using EBSD. Above 125&#xa0;°C, the Σ3 boundary length exceeded 40%, while below 120&#xa0;°C it rapidly declined, transforming into Σ27a, indicating a critical transition dominated by the {115} plane. A temperature–time-dependent grain growth model was developed, incorporating CSL effects. Simulations showed grain evolution and timing of CSL boundary formation, with transition times from 316 to 190&#xa0;s as temperature increased.</p>

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Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2025年8月22日

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  • Yun-Fong Lee,
  • Chih-Wen Chiu,
  • Chin-Yen Chiu,
  • Yu-Chen Huang,
  • Mei-Hsin Lo,
  • Liu-Hsin-Chen Yang,
  • Ting-Yi Cheng,
  • Zhong-Yen Yu,
  • Chih-En Hsu,
  • Kai-Chi Lin,
  • Po-Yu Chen,
  • Wei-Cheih Huang,
  • Jui-Sheng Chang,
  • Shao-An Pan,
  • Yi-Cheng Su,
  • Chin-Li Lin,
  • Hang-Chen Hsieh,
  • Chia-Hua Lin,
  • Cheng-Yi Liu

摘要

Cu–Cu direct bonding using electroplated ultrafine-grain Cu (107.24 nm) was studied in air at 110–150 °C. Unstable grain boundaries enabled ultrafast grain growth across the bonding interface, analyzed via coincidence site lattice (CSL) boundaries using EBSD. Above 125 °C, the Σ3 boundary length exceeded 40%, while below 120 °C it rapidly declined, transforming into Σ27a, indicating a critical transition dominated by the {115} plane. A temperature–time-dependent grain growth model was developed, incorporating CSL effects. Simulations showed grain evolution and timing of CSL boundary formation, with transition times from 316 to 190 s as temperature increased.