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<p>In this work, SiCN thin films were deposited on p-Si (100) substrate using a thermal Chemical Vapor Deposition (CVD) process. The mechanical behavior of the thin film was characterized using the nanoindentation technique, where the load was varied from 1 to 4 mN, to understand the influence of load variation on the load-displacement response. Additionally, an experimentally validated FE model, incorporating an elast-plastic material response of the thin film, was developed to understand localized stress distribution and fracture behavior. The fracture behavior is examined through two modes: (a) cracking and interfacial delamination during the nano-indentation test and (b) the peel test. The FE model revealed that in the case of the weak cohesive interface between SiCN and Si, the interfacial failure initiates at a critical displacement of <InlineEquation ID="IEq1"> <InlineMediaObject> <ImageObject Color="BlackWhite" FileRef="41598_2025_15659_Article_IEq1.gif" Format="GIF" Height="6" Rendition="HTML" Resolution="72" Type="Linedraw" Width="17" /> </InlineMediaObject> <EquationSource Format="TEX">\(\sim\)</EquationSource> </InlineEquation> 110 nm. During the peel test, it was observed that the critical fracture energy of the interface plays a significant role in the interface debonding. These finding highlights the strong dependence of the mechanical integrity of the SiCN thin film on the applied load.</p>

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Experimentally validated finite element model for mechanical and fracture characteristics of SiCN thin films under different loads

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2025年8月28日

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  • Dhruva Kumar,
  • Rajesh Kumar Meena,
  • Hirshikesh,
  • Ranjan Kumar Ghadai

摘要

In this work, SiCN thin films were deposited on p-Si (100) substrate using a thermal Chemical Vapor Deposition (CVD) process. The mechanical behavior of the thin film was characterized using the nanoindentation technique, where the load was varied from 1 to 4 mN, to understand the influence of load variation on the load-displacement response. Additionally, an experimentally validated FE model, incorporating an elast-plastic material response of the thin film, was developed to understand localized stress distribution and fracture behavior. The fracture behavior is examined through two modes: (a) cracking and interfacial delamination during the nano-indentation test and (b) the peel test. The FE model revealed that in the case of the weak cohesive interface between SiCN and Si, the interfacial failure initiates at a critical displacement of \(\sim\) 110 nm. During the peel test, it was observed that the critical fracture energy of the interface plays a significant role in the interface debonding. These finding highlights the strong dependence of the mechanical integrity of the SiCN thin film on the applied load.