<p>In-situ imaging of chemical reactions can provide valuable insight into nanoparticle growth and structural evolution. Hard X-ray imaging is an excellent tool for this purpose, as it combines high spatial resolution with high penetration depth, allowing for realistic reaction environments. While far-field ptychography is a well-established method at synchrotron radiation sources, its near-field analog has received less attention. In this work we show that near-field multi-slice ptychography is a competitive method for high-resolution in-situ imaging by studying the formation of gold nanocages via galvanic replacement. Our work extends near-field X-ray ptychography to sub-50 nm spatial resolution by using multilayer Laue lenses. These high numerical aperture optics enable to distinguish sample layers that are separated by less than 100 µm by multi-slicing techniques.</p>

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X-ray near-field multi-slice ptychography for in-situ imaging

  • Sina Röper,
  • Karolina Stachnik,
  • Jonas Voss,
  • Sarah-Alexandra Hussak,
  • Mattias Åstrand,
  • Lukas Grote,
  • Felix Wittwer,
  • Martin Seyrich,
  • Sven Niese,
  • Peter Gawlitza,
  • Ulrich Vogt,
  • Christian G. Schroer,
  • Dorota Koziej,
  • Andreas Schropp

摘要

In-situ imaging of chemical reactions can provide valuable insight into nanoparticle growth and structural evolution. Hard X-ray imaging is an excellent tool for this purpose, as it combines high spatial resolution with high penetration depth, allowing for realistic reaction environments. While far-field ptychography is a well-established method at synchrotron radiation sources, its near-field analog has received less attention. In this work we show that near-field multi-slice ptychography is a competitive method for high-resolution in-situ imaging by studying the formation of gold nanocages via galvanic replacement. Our work extends near-field X-ray ptychography to sub-50 nm spatial resolution by using multilayer Laue lenses. These high numerical aperture optics enable to distinguish sample layers that are separated by less than 100 µm by multi-slicing techniques.