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<p>Thermal and power integrity management remains a fundamental challenge in 2.5-dimensional (2.5D) integrated microsystem design. This paper proposes an electrothermal co-optimization design methodology for a 2.5D power distribution network with thermal through silicon via (TTSV) cooling. A hybrid metaheuristic optimization algorithm is presented to optimize the multi-objective function in terms of both the electrothermal properties and manufacturing cost. The proposed approach achieves an optimal solution (minimum fitness value = 310.3) for TTSV scaling and chiplet placement, albeit with increased computational complexity. Compared to the finite element simulation results, the average absolute errors of the impedance and temperature values obtained from the optimization are 3.97<InlineEquation ID="IEq1"> <InlineMediaObject> <ImageObject Color="BlackWhite" FileRef="41598_2025_9914_Article_IEq1.gif" Format="GIF" Height="16" Rendition="HTML" Resolution="72" Type="Linedraw" Width="15" /> </InlineMediaObject> <EquationSource Format="TEX">\(\%\)</EquationSource> </InlineEquation> and 0.35<InlineEquation ID="IEq2"> <InlineMediaObject> <ImageObject Color="BlackWhite" FileRef="41598_2025_9914_Article_IEq1.gif" Format="GIF" Height="16" Rendition="HTML" Resolution="72" Type="Linedraw" Width="15" /> </InlineMediaObject> <EquationSource Format="TEX">\(\%\)</EquationSource> </InlineEquation>, respectively. The proposed method is effective in enhancing thermal management, satisfying power and signal integrity requirements, and minimizing manufacturing costs.</p>

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Electrothermal co-optimization of 2.5D power distribution network with TTSV cooling

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2025年7月16日

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  • Yang Wang,
  • Changle Zhi,
  • Gang Dong,
  • Daihang Liu,
  • Deguang Yang,
  • Zhangming Zhu

摘要

Thermal and power integrity management remains a fundamental challenge in 2.5-dimensional (2.5D) integrated microsystem design. This paper proposes an electrothermal co-optimization design methodology for a 2.5D power distribution network with thermal through silicon via (TTSV) cooling. A hybrid metaheuristic optimization algorithm is presented to optimize the multi-objective function in terms of both the electrothermal properties and manufacturing cost. The proposed approach achieves an optimal solution (minimum fitness value = 310.3) for TTSV scaling and chiplet placement, albeit with increased computational complexity. Compared to the finite element simulation results, the average absolute errors of the impedance and temperature values obtained from the optimization are 3.97 \(\%\) and 0.35 \(\%\) , respectively. The proposed method is effective in enhancing thermal management, satisfying power and signal integrity requirements, and minimizing manufacturing costs.