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<p>This work demonstrates a highly efficient, zero-power-consumption evaporative cooling system for managing heat generated by SiC MOSFETs operating near their current capacity. The system employs capillary-driven water transport through cotton ropes to an aluminum heatsink, where cellulose paper spreads the water for even evaporation. The process effectively lowers the junction temperature (<i>T</i><sub><i>j</i></sub>) of the MOSFETs, monitored in real-time using the correlation between its on-resistance (<i>R</i><sub><i>ON</i></sub>) and <i>T</i><sub><i>j</i></sub>. Evaporative cooling dissipates 42% of total heat without a fan and 89% with a fan. COMSOL simulations are performed and can closely match experimental data, highlighting that optimizing heat transfer between the lead frame and heatsink and increasing the cooling fin height are the keys to further improve the evaporative cooling efficiency. This study offers a sustainable and efficient cooling solution for high-power SiC MOSFETs, reducing reliance on energy-intensive cooling systems and demonstrating potential scalability for industrial applications.</p>

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Zero-Power consumption based evaporative cooling for rated current conduction in SiC mosfets

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2025年5月10日

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  • Kuo-Bin Hong,
  • Shivendra Kumar Singh,
  • Chen Sung,
  • Yu-Sheng Hsiao,
  • Yi-Kai Hsiao,
  • Yogesh Singh Chauhan,
  • Hao-Chung Kuo,
  • Tian-Li Wu,
  • Chang-Ching Tu

摘要

This work demonstrates a highly efficient, zero-power-consumption evaporative cooling system for managing heat generated by SiC MOSFETs operating near their current capacity. The system employs capillary-driven water transport through cotton ropes to an aluminum heatsink, where cellulose paper spreads the water for even evaporation. The process effectively lowers the junction temperature (Tj) of the MOSFETs, monitored in real-time using the correlation between its on-resistance (RON) and Tj. Evaporative cooling dissipates 42% of total heat without a fan and 89% with a fan. COMSOL simulations are performed and can closely match experimental data, highlighting that optimizing heat transfer between the lead frame and heatsink and increasing the cooling fin height are the keys to further improve the evaporative cooling efficiency. This study offers a sustainable and efficient cooling solution for high-power SiC MOSFETs, reducing reliance on energy-intensive cooling systems and demonstrating potential scalability for industrial applications.