Evaluating predictive scheme for thermomechanical properties of Si-diamond composites

A novel, parameter-independent multiscale correlational constitutive model has been devised to predict thermomechanical properties of Si-diamond-SiC and Si-diamond composites, including the effective elastic modulus, effective bulk modulus, effective shear modulus, effective Poisson’s ratio, average coefficients of thermal expansion as well as thermal conductivity. Based on this model, the effective thermomechanical response of two kinds of composites was simulated, and the underlying mechanisms of thermomechanical coupling between constituents were also critically evaluated. The findings were shown that the effective elastic properties of composites, including effective elastic modulus, effective bulk modulus, effective shear modulus, increased with diamond and SiC, and that the introduction of dispersed diamond with highly thermal conductivity and lowly thermal expansion significantly enhanced thermophysical properties of Si-diamond-SiC composites. The thermomechanical coupling of these composites was influenced by the effective elastic properties of composites and the disparity in the intrinsic properties of constituents.