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<p>The rapid expansion of data-centric technologies has made energy-efficient computing a technological and societal priority. Modern systems consume energy not only through computation but also through data movement between logic and memory, resistive losses in interconnects and heat removal. These energy costs intensify as devices shrink and integration density increases. Architectural strategies such as three-dimensional integration reduce latency and increase functional density by bringing memory and logic closer together. Yet further scaling is progressively constrained by materials functionality at interfaces, rather than by bulk properties. In this Perspective, we argue that transport within the first few atomic layers at material boundaries will determine the efficiency and scalability of future electronic devices. First, we outline four governing principles of interface engineering: electrostatics, electronic&#xa0;hybridization, boundary-dominated transport and thermal and structural stability. We then derive design rules and use representative device examples to show how engineered interfaces control switching energy, electrical conduction, heat dissipation and reliability. Finally, we consider the need for low-temperature materials synthesis, interface-sensitive metrology and uncertainty-aware predictive modelling to facilitate future advances in energy-efficient computing.</p>

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Engineered interfaces in electronic materials for energy-efficient computing

  • 期刊论文

  • 发表日期：

    2026年8月3日

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  • Sathvik Ajay Iyengar,
  • Pulickel M. Ajayan,
  • Vincent Meunier,
  • Tahir Ghani,
  • Sayeef Salahuddin,
  • Asir Intisar Khan

摘要

The rapid expansion of data-centric technologies has made energy-efficient computing a technological and societal priority. Modern systems consume energy not only through computation but also through data movement between logic and memory, resistive losses in interconnects and heat removal. These energy costs intensify as devices shrink and integration density increases. Architectural strategies such as three-dimensional integration reduce latency and increase functional density by bringing memory and logic closer together. Yet further scaling is progressively constrained by materials functionality at interfaces, rather than by bulk properties. In this Perspective, we argue that transport within the first few atomic layers at material boundaries will determine the efficiency and scalability of future electronic devices. First, we outline four governing principles of interface engineering: electrostatics, electronic hybridization, boundary-dominated transport and thermal and structural stability. We then derive design rules and use representative device examples to show how engineered interfaces control switching energy, electrical conduction, heat dissipation and reliability. Finally, we consider the need for low-temperature materials synthesis, interface-sensitive metrology and uncertainty-aware predictive modelling to facilitate future advances in energy-efficient computing.