Isolator-free laser operation enabled by chip-scale reflections in zero-process-change silicon-on-insulator
摘要
The isolation-free operation of photonic integrated circuits enables dense integration, reducing packaging costs and complexity. Most isolator replacements require a change in the silicon-on-insulator foundry process and suffer from large insertion loss. Most solutions focused on resonant devices, and measurements with modulated reflections have also been missing. Here we present a zero-process-change silicon photonic circuit that, when paired with an integrated distributed-feedback (DFB) laser, enhances the DFB’s immunity to continuous-wave and modulated parasitic reflections from multiple reflectors. The circuit generates intentional, controlled self-injection to stabilize laser dynamics and maintain operation. The silicon photonic circuit is complemented by an electro-optic feedback loop that dynamically adjusts the self-injection to preserve laser stability. The proposed circuit introduces an insertion loss of 1.67 dB and enables the DFB laser to tolerate back reflections as large as −7 dB and −12 dB from on-chip and off-chip reflectors, respectively. The DFB is hybrid integrated with the silicon photonic chip using a photonic wire bond. The isolator-free operation of the integrated laser in a high-speed optical link has been demonstrated, highlighting its potential for data communication applications.