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<p>Mechanical computing, utilizing mechanical deformation to perform calculations, has attracted significant attention as an innovative computing strategy for achieving high accuracy and exceptional physical robustness. However, its reliance on passive mechanical displacement limits its applicability for complex computations. This study presents a novel system that enables active light signal modulation through reversible mechanical deformation by integrating soft and 3D electronics. The proposed system features: 1) Optical fibers with optimized 3D cracks embedded in a low-modulus, high-elongation material, enabling strain-induced multimodal transitions. 2) Maximized stress concentration on the cracked fibers under strain, allowing them to function as active components for light modulation, which facilitates complex logic calculations and validates truth tables. <InternalRef RefID="MOESM1">3</InternalRef>) Multifunctional vibration sensing capabilities, illustrating the scalability of strain inputs and the potential for dynamic applications, such as soft robotics. These findings underscore the potential of this approach as a computational platform for mechanical motion-based technologies.</p>

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Logic-device-inspired mechanical computing system based on three-dimensional active components

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2025年11月28日

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  • Jun Hyun Park,
  • Jang Hwan Kim,
  • Ha Uk Chung,
  • Jun Seok Choe,
  • Hyokyeong Kim,
  • Su Eon Lee,
  • Simon Kim,
  • Ho Jun Jin,
  • Jiwoong Kim,
  • Heon Lee,
  • Jaehwan Kim,
  • Bong Hoon Kim

摘要

Mechanical computing, utilizing mechanical deformation to perform calculations, has attracted significant attention as an innovative computing strategy for achieving high accuracy and exceptional physical robustness. However, its reliance on passive mechanical displacement limits its applicability for complex computations. This study presents a novel system that enables active light signal modulation through reversible mechanical deformation by integrating soft and 3D electronics. The proposed system features: 1) Optical fibers with optimized 3D cracks embedded in a low-modulus, high-elongation material, enabling strain-induced multimodal transitions. 2) Maximized stress concentration on the cracked fibers under strain, allowing them to function as active components for light modulation, which facilitates complex logic calculations and validates truth tables. 3) Multifunctional vibration sensing capabilities, illustrating the scalability of strain inputs and the potential for dynamic applications, such as soft robotics. These findings underscore the potential of this approach as a computational platform for mechanical motion-based technologies.