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<p>Flexible electronics advancement intensifies thermal management needs. Radiative cooling shows promise but faces implementation challenges. Integration into diverse flexible electronics demands application-specific materials and processes. A comprehensive review systematically analyzing these strategies is lacking. This work examines both technologies’ historical development, synthesizes radiative cooling implementation strategies across electronic systems, and critically evaluates persistent challenges. It aims to provide actionable guidance for advancing practical applications.</p>

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Radiative cooling drives the integration and application of thermal management in flexible electronic devices

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2025年10月10日

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  • Maoquan Zhang,
  • Xuwang Tian,
  • Jiajia Shen,
  • Jianhua Yan

摘要

Flexible electronics advancement intensifies thermal management needs. Radiative cooling shows promise but faces implementation challenges. Integration into diverse flexible electronics demands application-specific materials and processes. A comprehensive review systematically analyzing these strategies is lacking. This work examines both technologies’ historical development, synthesizes radiative cooling implementation strategies across electronic systems, and critically evaluates persistent challenges. It aims to provide actionable guidance for advancing practical applications.