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<p>Thermoelectric materials, despite their desirable heat-to-electricity conversion properties, have seen limited commercial viability due to their labor-intensive and high-cost conventional synthesis and assembly processes. Here, we demonstrate an ink printing/sintering approach which unlocks cost-effective fabrication of high-performing, geometrically-complex La<sub>3-x</sub>Te<sub>4</sub> thermoelectric legs with high relative densities and phase purity. LaTe<sub>1.47</sub> legs are created by ink-extrusion printing of pre-alloyed powders, followed by debinding and sintering at high temperature; they achieve a high figure of merit (zT = 1.49 ± 0.24 at 1250 K), on par with state-of-the-art LaTe<sub>1.46</sub> synthesized via traditional hot pressing. Furthermore, the ink printing methodology enables printing and diffusion bonding of non-flat interfaces between a LaTe<sub>1.47</sub> leg and a Ni electrode, which are designed to achieve high mechanical interlocking with minimal chemical interdiffusion. After measuring creep properties on dense La<sub>3-x</sub>Te<sub>4</sub>, we perform simulations of the thermomechanical stress at these LaTe<sub>1.47</sub>/Ni interlocking interfaces during operation; this demonstrates the importance of creep in relaxing the stress state of both phases and the potential for designed interfaces to mitigate crack propagation at the thermoelectric-metal junction. This additive approach addresses the key challenges with thermoelectric device fabrication, enabling thermoelectric devices which are economical, scalable and thermomechanically-robust at very high temperatures.</p>

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Extrusion-printed La3-xTe4 legs with interlocking Ni electrode for high-temperature thermoelectric devices

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2026年5月5日

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  • Alexander Pröschel,
  • Yunjia Zhang,
  • Ming Chen,
  • Kurt E. Star,
  • Duncan Zavanelli,
  • Sabah K. Bux,
  • G. Jeffrey Snyder,
  • David C. Dunand

摘要

Thermoelectric materials, despite their desirable heat-to-electricity conversion properties, have seen limited commercial viability due to their labor-intensive and high-cost conventional synthesis and assembly processes. Here, we demonstrate an ink printing/sintering approach which unlocks cost-effective fabrication of high-performing, geometrically-complex La3-xTe4 thermoelectric legs with high relative densities and phase purity. LaTe1.47 legs are created by ink-extrusion printing of pre-alloyed powders, followed by debinding and sintering at high temperature; they achieve a high figure of merit (zT = 1.49 ± 0.24 at 1250 K), on par with state-of-the-art LaTe1.46 synthesized via traditional hot pressing. Furthermore, the ink printing methodology enables printing and diffusion bonding of non-flat interfaces between a LaTe1.47 leg and a Ni electrode, which are designed to achieve high mechanical interlocking with minimal chemical interdiffusion. After measuring creep properties on dense La3-xTe4, we perform simulations of the thermomechanical stress at these LaTe1.47/Ni interlocking interfaces during operation; this demonstrates the importance of creep in relaxing the stress state of both phases and the potential for designed interfaces to mitigate crack propagation at the thermoelectric-metal junction. This additive approach addresses the key challenges with thermoelectric device fabrication, enabling thermoelectric devices which are economical, scalable and thermomechanically-robust at very high temperatures.