Scholarlink

<p>The ideal electronics packaging for next-generation wearable devices and integrated circuits would be a flexible material with high thermal conductivity of a metal. We report a liquid-metal polyurethane composite (LiMPuC) with a thermal conductivity of 23.42 W m<sup>-1</sup> K<sup>-1</sup> while retaining extreme stretchability. The performance arises from interfacial-chemistry-guided ordering of the polyurethane matrix and improved liquid-metal wetting. By modulating hydrogen-bond donor/acceptor densities in the thermoplastic polyurethane and grafting <b>–</b>NH<sub>2</sub> groups onto eutectic gallium–indium (EGaIn) droplets, we create anchored, reconfigurable interfaces that (i) increase matrix chain alignment and intrinsic heat transport and (ii) promote stable, strain-tolerant thermal near-percolation of the liquid metal. Under large tensile strain, these coupled effects preserve high conductivity and deliver a flexibility figure of merit &gt; 100. This chemistry-to-microstructure pathway, linking hydrogen-bond engineering with LM surface functionalization, provides a general strategy for designing flexible, high-<InlineEquation ID="IEq1"> <EquationSource Format="TEX">\(\kappa\)</EquationSource> <EquationSource Format="MATHML"><math> <mi>κ</mi> </math></EquationSource> </InlineEquation> composites for advanced thermal management in emerging electronics.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Flexible rubber with metal-like thermal conductivity achieved via hydrogen bonding engineering

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2026年3月24日

查看全文
  • Xirui Liu,
  • Jiawang Wen,
  • Rui Xu,
  • Meizhu Huang,
  • Jiajing Huang,
  • Wenbo Lin,
  • Min Luo,
  • Sivasambu Bohm,
  • G. Jeffrey Snyder,
  • Yue Lin

摘要

The ideal electronics packaging for next-generation wearable devices and integrated circuits would be a flexible material with high thermal conductivity of a metal. We report a liquid-metal polyurethane composite (LiMPuC) with a thermal conductivity of 23.42 W m-1 K-1 while retaining extreme stretchability. The performance arises from interfacial-chemistry-guided ordering of the polyurethane matrix and improved liquid-metal wetting. By modulating hydrogen-bond donor/acceptor densities in the thermoplastic polyurethane and grafting –NH2 groups onto eutectic gallium–indium (EGaIn) droplets, we create anchored, reconfigurable interfaces that (i) increase matrix chain alignment and intrinsic heat transport and (ii) promote stable, strain-tolerant thermal near-percolation of the liquid metal. Under large tensile strain, these coupled effects preserve high conductivity and deliver a flexibility figure of merit > 100. This chemistry-to-microstructure pathway, linking hydrogen-bond engineering with LM surface functionalization, provides a general strategy for designing flexible, high- \(\kappa\) κ composites for advanced thermal management in emerging electronics.