High temperature evaporative cooler utilizing boiling suppression at water’s boiling point
摘要
We experimentally demonstrate boiling suppression in a water film confined within superhydrophilic hierarchical nano/microstructured surfaces, enabling intense interfacial steam generation without bubble formation at the boiling point. Leveraging this phenomenon, we develop a high-temperature dew point evaporative cooler capable of reducing hot airflow from 437 °C to below ambient temperature. The cooler also performs effectively below the boiling point, lowering inlet air from 43 °C to 16.7 °C. These findings open pathways for potential practical applications of dew point evaporative cooling in power generation, internal combustion engines, and generative AI systems.