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<p>On-chip inductors enable high integration in radio-frequency electronics, critical for compact, power-efficient systems. However, they often occupy a large chip area due to low inductance density (<i>D</i>, defined as the total inductance per unit area) that scales sublinearly with conductor length (<i>l</i>) in planar architectures. Here, we present a three-dimensional rolled-up, magnetically integrated microinductor technology with record-high inductance density. By exploiting a superlinear scaling law (<i>D</i> ∝ <i>l</i><sup>2.4</sup>) via 3D winding with magnetic thin films, our devices achieve 8333 nH/mm² at 0.55 GHz—over two orders of magnitude higher than conventional planar inductors. This breakthrough stems from a 3D geometry in which strained layers confine multiple turns in a compact tubular volume, intensifying local fields and flux linkage while reducing leakage. A wafer-scale, CMOS-compatible process yields self-assembled coils that roll 10 mm of planar conductors into ~240 μm-diameter microcoils. The high inductance density, low substrate losses, and GHz operation make magnetically integrated inductors suited for more compact radio-frequency systems-on-chip and high-frequency power modules and next-generation Internet of Things/5G/6G applications.</p>

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High inductance density in CMOS-compatible magnetically integrated 3D microinductors for radio-frequency applications

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2025年11月18日

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  • Li Chen,
  • Zhiyuan Qiao,
  • Shengbao Liu,
  • Jinbo Yang,
  • Yue Wu,
  • Pengchuan Liu,
  • Zhi Zheng,
  • Luozhao Zhang,
  • Yuhang Hu,
  • Tingqi Wu,
  • Wen Huang,
  • Yongfeng Mei,
  • Gaoshan Huang,
  • Jizhai Cui

摘要

On-chip inductors enable high integration in radio-frequency electronics, critical for compact, power-efficient systems. However, they often occupy a large chip area due to low inductance density (D, defined as the total inductance per unit area) that scales sublinearly with conductor length (l) in planar architectures. Here, we present a three-dimensional rolled-up, magnetically integrated microinductor technology with record-high inductance density. By exploiting a superlinear scaling law (D ∝ l2.4) via 3D winding with magnetic thin films, our devices achieve 8333 nH/mm² at 0.55 GHz—over two orders of magnitude higher than conventional planar inductors. This breakthrough stems from a 3D geometry in which strained layers confine multiple turns in a compact tubular volume, intensifying local fields and flux linkage while reducing leakage. A wafer-scale, CMOS-compatible process yields self-assembled coils that roll 10 mm of planar conductors into ~240 μm-diameter microcoils. The high inductance density, low substrate losses, and GHz operation make magnetically integrated inductors suited for more compact radio-frequency systems-on-chip and high-frequency power modules and next-generation Internet of Things/5G/6G applications.