<p>Polymer dielectrics with enhanced thermal stability and electrical insulation are urgently needed for capacitive energy storage applications in electric power systems. There is a persistent challenge to break the contradictory correlation between high&#xa0;heat resistance and&#xa0;low electrical conduction in polymers. Here, we employ benzyl-induced crosslinking to rearrange short-range structural units in polyimide chains, reducing electrical conduction loss. The designed polymer exhibits an electrical conductivity more than 3 orders of magnitude lower than that of commercial heat-resistant polymers, while its glass transition temperature (<i>T</i><sub><i>g</i></sub>) increases from 236.31 °C (for polyetherimide) to 289.72 °C. Consequently, a discharged energy densities of 6.38 J cm<sup>−3</sup> and 3.04 J cm<sup>−3</sup>, with charge-discharge efficiencies above 90%, are achieved at 200 °C and 250 °C, respectively, demonstrating among the best in all-organic dielectric polymers. This work presents a feasible approach to break the adverse correlation between thermal stability and electrical insulation in polyimide materials.</p>

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Decoupling thermal stability and insulation in dielectric polymers via donor-acceptor rearrangement

  • Yuting Wan,
  • Hang Luo,
  • Zhongna Yan,
  • Shuyi Shen,
  • Jiajun Peng,
  • Xiaona Li,
  • Guanghu He,
  • Dou Zhang,
  • Jun-Wei Zha

摘要

Polymer dielectrics with enhanced thermal stability and electrical insulation are urgently needed for capacitive energy storage applications in electric power systems. There is a persistent challenge to break the contradictory correlation between high heat resistance and low electrical conduction in polymers. Here, we employ benzyl-induced crosslinking to rearrange short-range structural units in polyimide chains, reducing electrical conduction loss. The designed polymer exhibits an electrical conductivity more than 3 orders of magnitude lower than that of commercial heat-resistant polymers, while its glass transition temperature (Tg) increases from 236.31 °C (for polyetherimide) to 289.72 °C. Consequently, a discharged energy densities of 6.38 J cm−3 and 3.04 J cm−3, with charge-discharge efficiencies above 90%, are achieved at 200 °C and 250 °C, respectively, demonstrating among the best in all-organic dielectric polymers. This work presents a feasible approach to break the adverse correlation between thermal stability and electrical insulation in polyimide materials.