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<p>As semiconductor devices approach fundamental physical scaling limits, molecular electronics has emerged as a potential technological paradigm for sustaining Moore’s Law through the capabilities of single-molecule-scale functional manipulation and quantum modulation. At the foundational research level, the convergence of atomic-precision fabrication techniques with molecule–electrode interfaces and molecular orbital engineering has enabled the directional construction of electronically functional single-molecule devices, including molecular switches, rectifiers, and field-effect transistors, accompanied by preliminary validations of molecular device array integration. However, molecular electronics confronts multifaceted challenges spanning device-level bottlenecks in precise molecular assembly, accurate quantum charge transport characterizations, and performance reproducibility, coupled with integration-level limitations imposed by conventional two-dimensional planar architectures that fundamentally constrain functional density scaling, rendering the realization of high-density integrated molecular devices with operational logic capabilities exceptionally demanding. To address these critical issues, researchers have developed various device fabrication and characterization techniques in recent years, such as the integration of top-down micro/nano-fabrication technologies with bottom-up atomic manufacturing approaches, which have significantly enhanced the stability of molecular devices and data reproducibility. This review systematically summarizes recent advances in preparation methodologies for molecular electronic devices with high reproducibility and reliability, with prospective emphasis on an integrated architecture strategy combining atomic manufacturing technologies with three-dimensional (3D) integrated manufacturing technologies, offering a potential roadmap to transcend conventional two-dimensional integration paradigms and realize logical computing functionalities in molecular electronic devices.</p><p></p>

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Molecular electronic devices based on atomic manufacturing methods

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2025年11月28日

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  • Chengpeng Yao,
  • Yaning Li,
  • Hao Zhang,
  • Dongdong Wang,
  • Jia Wang,
  • Xiaojing Wang,
  • Xiaohui Li,
  • Junyang Liu,
  • Wenjing Hong

摘要

As semiconductor devices approach fundamental physical scaling limits, molecular electronics has emerged as a potential technological paradigm for sustaining Moore’s Law through the capabilities of single-molecule-scale functional manipulation and quantum modulation. At the foundational research level, the convergence of atomic-precision fabrication techniques with molecule–electrode interfaces and molecular orbital engineering has enabled the directional construction of electronically functional single-molecule devices, including molecular switches, rectifiers, and field-effect transistors, accompanied by preliminary validations of molecular device array integration. However, molecular electronics confronts multifaceted challenges spanning device-level bottlenecks in precise molecular assembly, accurate quantum charge transport characterizations, and performance reproducibility, coupled with integration-level limitations imposed by conventional two-dimensional planar architectures that fundamentally constrain functional density scaling, rendering the realization of high-density integrated molecular devices with operational logic capabilities exceptionally demanding. To address these critical issues, researchers have developed various device fabrication and characterization techniques in recent years, such as the integration of top-down micro/nano-fabrication technologies with bottom-up atomic manufacturing approaches, which have significantly enhanced the stability of molecular devices and data reproducibility. This review systematically summarizes recent advances in preparation methodologies for molecular electronic devices with high reproducibility and reliability, with prospective emphasis on an integrated architecture strategy combining atomic manufacturing technologies with three-dimensional (3D) integrated manufacturing technologies, offering a potential roadmap to transcend conventional two-dimensional integration paradigms and realize logical computing functionalities in molecular electronic devices.