Ferroelectric behavior of E-beam evaporated Hf0.5Zr0.5O2 thin film and integration with GaN HEMTs toward programmable current switching
摘要
This letter demonstrates an AlGaN/GaN high-electron-mobility transistors (HEMTs) incorporating a Hf0.5Zr0.5O2 (HZO)/Al2O3 ferroelectric gate dielectric fabricated via electron-beam evaporation (E-beam) technique. Through precise control of HZO growth processes and post-annealing treatments, high-quality ferroelectric thin films were obtained, acting as the gate dielectric, enabling an ultra-high current on/off ratio of 108, a low subthreshold slope (SS) of 64.4 mV/dec, and a wide tuning range of the threshold voltage (VTH). Our work indicates that ferroelectric polarization significantly influences electron transport behavior at the AlGaN/GaN interface, highlighting the potential of E-beam evaporated HZO thin film used in the application of next-generation power electronic systems.