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<p>Chemical mechanical polishing (CMP) is critical in semiconductor and integrated circuit (IC) manufacturing, with increasing demands for higher performance, including minimizing defects, enhancing planarization uniformity, and improving material removal rate (MRR). Amino acids, a key component in CMP slurries, play a significant role due to their zwitterionic nature, biocompatibility, and lower toxicity compared to traditional additives. This review examines the mechanisms through which amino acids interact with various materials such as copper, cobalt, and interlayer dielectrics, impacting MRR, surface quality, and defect rates. The review compares different amino acids under various CMP conditions, focusing on mechanisms like complexation, passivation, and optimization of material selectivity. Additionally, it discusses the sustainability of amino acid-based slurries and provides future research directions for their use in more efficient and eco-friendly semiconductor manufacturing.</p> Graphical Abstract <p></p>

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Application of amino acids as auxiliary reagents in chemical mechanical polishing: an in-depth review

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2025年5月9日

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  • Jiakai Zhou,
  • Chao He,
  • Changxin Dong,
  • Xinjie Li,
  • Zheng Wu,
  • Bin Hu,
  • Jiahui Li,
  • Ziliang Liu,
  • Qing Ma,
  • Shaobo Song,
  • Mengqi Wang,
  • Xinhuan Niu

摘要

Chemical mechanical polishing (CMP) is critical in semiconductor and integrated circuit (IC) manufacturing, with increasing demands for higher performance, including minimizing defects, enhancing planarization uniformity, and improving material removal rate (MRR). Amino acids, a key component in CMP slurries, play a significant role due to their zwitterionic nature, biocompatibility, and lower toxicity compared to traditional additives. This review examines the mechanisms through which amino acids interact with various materials such as copper, cobalt, and interlayer dielectrics, impacting MRR, surface quality, and defect rates. The review compares different amino acids under various CMP conditions, focusing on mechanisms like complexation, passivation, and optimization of material selectivity. Additionally, it discusses the sustainability of amino acid-based slurries and provides future research directions for their use in more efficient and eco-friendly semiconductor manufacturing.

Graphical Abstract