Failure of adhesive bonding unveiled by in-situ strain testing by high-resolution scanning transmission electron microscopy

The nano-scale failure behaviors of adhesive interfaces were investigated through in-situ straining testing to observe real-time crack propagations under a scanning transmission electron microscope (STEM). Two different loading modes were applied to thin sections of adhesive interfaces: crack-opening mode applied to pre-cracks made at the interface and shear mode. The failure of aluminum alloy (Al6061) and a second-generation acrylic adhesive (SGA) was examined, enabling observation of the growth of crazing in the adhesive layer, which has a phase-separated structure, preceding the macroscopic failure of the interfaces. Furthermore, the failure of a direct joint of thermoplastic and Al was investigated, with a comparison made to that observed in the adhesive interface. The generation and propagation of cracks near the interface, attributed to the adhesive's phase separation, contribute to the toughness of the adhesive interface. Both the direction of stress acting on the interface and the interface's strength influence the initiation and growth of cracks throughout the adhesive layer.