Application of Artificial Intelligence in Solid-State Impedance Matching for Radio Frequency Power Supplies: A Review
摘要
As core equipment in semiconductor processing, thin-film fabrication and related fields, the impedance matching performance of radio-frequency power supplies directly determines power transmission efficiency and system stability. Traditional matching methods often encounter challenges such as slow convergence and poor load adaptability when dealing with dynamic loads and highly non-linear systems. Recent years have witnessed rapid advancements in artificial intelligence (AI) technologies, offering novel solutions for impedance matching. This paper systematically reviews the application progress of algorithms such as swarm intelligence optimization, machine learning modeling, and deep reinforcement learning control in Radio frequency (RF) power supply impedance matching. Finally, it discusses current challenges faced by AI in impedance matching and outlines future research directions to advance RF power supply impedance matching technology towards greater intelligence, adaptability, and system synergy.