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<p>Defect detection is a crucial task in screen-printed circuit (SPC) production, where image processing method based on deep learning is often used. This field frequently encounters challenges, such as minute surface defects, a large number of model parameters, and high computational complexity. To address these challenges, a self-made SPC defect data set and an enhanced CAAB-YOLOv8n detection algorithm were developed. A CAD module was integrated into the backbone network to improve the model’s ability to detect bar-shaped features. In addition, the ASF feature fusion and RMT modules were combined to construct the ASF-CR neck structure, which enhances the model’s capability to detect small, localized defects. To expedite inference speed, the DBB-Head reparameterization module was incorporated. Experimental results show that the enhanced algorithm achieves 88.4<InlineEquation ID="IEq1"> <InlineMediaObject> <ImageObject Color="BlackWhite" FileRef="44196_2025_815_Article_IEq1.gif" Format="GIF" Height="16" Rendition="HTML" Resolution="72" Type="Linedraw" Width="15" /> </InlineMediaObject> <EquationSource Format="TEX">\(\%\)</EquationSource> <EquationSource Format="MATHML"><math> <mo>%</mo> </math></EquationSource> </InlineEquation> accuracy, a mAP@50 of 90.2<InlineEquation ID="IEq2"> <InlineMediaObject> <ImageObject Color="BlackWhite" FileRef="44196_2025_815_Article_IEq2.gif" Format="GIF" Height="16" Rendition="HTML" Resolution="72" Type="Linedraw" Width="15" /> </InlineMediaObject> <EquationSource Format="TEX">\(\%\)</EquationSource> <EquationSource Format="MATHML"><math> <mo>%</mo> </math></EquationSource> </InlineEquation>, and a parameter count of just 33.27 million, with a detection speed of 35.2 frames per second. The real-time requirements for SPC defect detection are met by these findings. This work lays a solid theoretical foundation for subsequent defect traceability and the optimization of printing process parameters.</p>

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Defects Detection in Screen-Printed Circuits Based on an Enhanced YOLOv8n Algorithm

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2025年5月5日

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  • Xinyu Zhang,
  • Jia Wang,
  • Dan Jiang,
  • Yang Li,
  • Xuewei Wang,
  • Han Zhang

摘要

Defect detection is a crucial task in screen-printed circuit (SPC) production, where image processing method based on deep learning is often used. This field frequently encounters challenges, such as minute surface defects, a large number of model parameters, and high computational complexity. To address these challenges, a self-made SPC defect data set and an enhanced CAAB-YOLOv8n detection algorithm were developed. A CAD module was integrated into the backbone network to improve the model’s ability to detect bar-shaped features. In addition, the ASF feature fusion and RMT modules were combined to construct the ASF-CR neck structure, which enhances the model’s capability to detect small, localized defects. To expedite inference speed, the DBB-Head reparameterization module was incorporated. Experimental results show that the enhanced algorithm achieves 88.4 \(\%\) % accuracy, a mAP@50 of 90.2 \(\%\) % , and a parameter count of just 33.27 million, with a detection speed of 35.2 frames per second. The real-time requirements for SPC defect detection are met by these findings. This work lays a solid theoretical foundation for subsequent defect traceability and the optimization of printing process parameters.