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<p>The formation of hierarchical microstructures in pure copper provides an effective strategy for achieving a superior combination of mechanical strength, ductility, and electrical conductivity. In this study, hydrostatic twist extrusion (HTE) was employed to process relatively long bulk Cu billets and generate a gradient hierarchical structure. Microstructural characterization using EBSD and optical microscopy shows that torsional deformation is mainly accommodated by deformation twinning, leading to coarse grains embedded with twin lamellae and a pronounced gradient in twin thickness from the billet center toward the surface. Increasing the number of HTE passes intensifies this gradient and refines the twin structure. Following two HTE passes, the processed copper exhibits a uniform elongation of approximately 6%, a total elongation of about 20%, and a high ultimate tensile strength of ~ 384&#xa0;MPa, while retaining excellent electrical conductivity of ~ 92% IACS. Notably, the material achieves an exceptional electrical conductivity–uniform elongation product of approximately 553, exceeding previously reported values. This energy-efficient, scalable approach overcomes the strength-ductility-conductivity trade-off, positioning HTE as promising for high-performance components in electrical, and structural applications.</p>

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Achieving high strength and electrical conductivity in hierarchical structured pure copper

  • 期刊论文

  • 发表日期：

    2026年3月27日

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  • M. R. Sabour,
  • E. Taherkhani,
  • V. Tavakkoli,
  • A. Jalali Aghchai,
  • G. Faraji

摘要

The formation of hierarchical microstructures in pure copper provides an effective strategy for achieving a superior combination of mechanical strength, ductility, and electrical conductivity. In this study, hydrostatic twist extrusion (HTE) was employed to process relatively long bulk Cu billets and generate a gradient hierarchical structure. Microstructural characterization using EBSD and optical microscopy shows that torsional deformation is mainly accommodated by deformation twinning, leading to coarse grains embedded with twin lamellae and a pronounced gradient in twin thickness from the billet center toward the surface. Increasing the number of HTE passes intensifies this gradient and refines the twin structure. Following two HTE passes, the processed copper exhibits a uniform elongation of approximately 6%, a total elongation of about 20%, and a high ultimate tensile strength of ~ 384 MPa, while retaining excellent electrical conductivity of ~ 92% IACS. Notably, the material achieves an exceptional electrical conductivity–uniform elongation product of approximately 553, exceeding previously reported values. This energy-efficient, scalable approach overcomes the strength-ductility-conductivity trade-off, positioning HTE as promising for high-performance components in electrical, and structural applications.