Optimized Operation Methods of the Wafer Surface Defect Detection

In semiconductor manufacturing, the wafer surface defect detection system is the key role in controlling production quality and efficiency. Recently, computer vision, big data and artificial intelligence contribute to develop the wafer surface defect detection system, efficiently. We suggest optimized operation methods of 2D and 3D scattered data by searching the global minimum of the minimax problem for a set of points in the wafer surface defect detection system. The problem is applied to analyze the wafer surface defect detection system. As a result, mathematically, we obtain the exact solution of circle or sphere from the suggested problems. This is new measurement to analyze the wafer surface defect detection system.