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<p>Plasma-facing components in thermonuclear reactors primarily consist of plasma-facing materials and heat-sink materials. Tungsten-based materials are currently regarded as the most promising candidates as plasma-facing materials, while Cu alloys are typically utilized as heat-sink materials. However, bonding tungsten-based materials and Cu alloys together is challenging due to the inherent immiscibility of W and Cu. This review outlines advanced bonding technologies for tungsten-based materials and Cu alloys by tailoring joint interfaces. These technologies encompass: (i) direct diffusion bonding of W and Cu using high-temperature conditions (close to the melting point of Cu) structure, with an emphasis on elucidating the underlying thermodynamic mechanisms through the construction of thermodynamic models and molecular dynamics simulations; (ii) combined technologies involving surface treatments of tungsten-based materials, copper embedding, and diffusion bonding, along with an analysis of the mechanisms that enhance joint properties through tailored interface structures. The review also provides insights into future research directions for bonding between tungsten-based materials and Cu alloys. These advancements may offer significant support for plasma-facing components in future thermonuclear fusion reactors.</p>

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Effect of interface structure on advanced bonding between tungsten-based materials and Cu alloys: a review

  • 期刊论文

  • 发表日期：

    2025年1月31日

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  • Yuan-Yuan Chen,
  • Zhang Liu,
  • Sai Ramudu Meka,
  • Yuan Huang,
  • Zu-Min Wang

摘要

Plasma-facing components in thermonuclear reactors primarily consist of plasma-facing materials and heat-sink materials. Tungsten-based materials are currently regarded as the most promising candidates as plasma-facing materials, while Cu alloys are typically utilized as heat-sink materials. However, bonding tungsten-based materials and Cu alloys together is challenging due to the inherent immiscibility of W and Cu. This review outlines advanced bonding technologies for tungsten-based materials and Cu alloys by tailoring joint interfaces. These technologies encompass: (i) direct diffusion bonding of W and Cu using high-temperature conditions (close to the melting point of Cu) structure, with an emphasis on elucidating the underlying thermodynamic mechanisms through the construction of thermodynamic models and molecular dynamics simulations; (ii) combined technologies involving surface treatments of tungsten-based materials, copper embedding, and diffusion bonding, along with an analysis of the mechanisms that enhance joint properties through tailored interface structures. The review also provides insights into future research directions for bonding between tungsten-based materials and Cu alloys. These advancements may offer significant support for plasma-facing components in future thermonuclear fusion reactors.